The CMI-760 plating thickness meter is equipped with an eddy current probe and a magnetic induction probe, so it can be used universally according to various needs of users.
Both the eddy current probe and magnetic induction probe are small, designed with a simple appearance, and are mechanically-electrically designed-manufactured with a high level of precision, boasting excellent measurement precision.
It can be measured by selecting a probe suitable for the user's usage conditions such as coating components, thickness measurement range, product size, and shape.
Tset fol, Laminate, Surface, Traces and Thtu-Hole copper with single device
Test Thin Film Thickness Measurement | test foil Cu |
Measurement of the thickness of the red-carved copper foil | laminated Cu |
Measurement of surface treatment copper thickness | Cu plated |
Copper Plated Line Traces | Copper trace |
PTH:Plating Thru-hole | Copper plating thickness measurement |
The CMI-760 copper-plated thickness meter provides basic tips that can be exchanged with the SRP-4 probe in the form of an extended cable, making it convenient to use as well as reducing costs.
The SRP-4 probe consists of a 4-pin and is sealed with a patented design for long-lasting durability without failure or wear. The probe tip made of a transparent case can position the probe exactly in the measurement position even for small samples. Extension cables can be used more conveniently in measuring copper plating thickness in the actual field.
Copper Plating Thickness Measurement Probe and Replacement Tip
category | standard |
---|---|
Product size | 29.21cm(W) x 26.67cm(D) x 13.97(H) 11.5"(W) x 10.5"(D) x 5.5"(H) |
Weight | 6Lbs.(2.79kg) |
Unit of measurement | mils, um, uin, mm, in, % Screen display and selectable |
Display | Large screen LCD, 480 x 32 pixels, backlight, wide angle view |
Display Statistics Data Screen | Measurements, Standard Deviation, Mean Value, Maximum, Minimum |
Graph | histogram, bent line trend graph, X-bar, R-bar chart |
SRP-4 PROBE | |
Measurement accuracy | +/-1% (+/-0.1um) Standard Specification (CRM) Accuracy |
Measurement accuracy | Electroless copper plating (Cu): 0.2% Electroplating (electrodeposited Cu): 0.3% |
Resolution | 0.1um (10um or more), 0.01um (10um or less)1um or more), 0.001um (1um or less) |
ETP PROBE | |
Measurement accuracy | +/-0.01mil 0.25um) < 1mil (25um) |
Measurement accuracy | 1.0% (1.2mils At the time of measurement) |
Resolution | 0.01mils (0.25um or more) |
eddy current system Thickness measurement range |
1~102um(0.08~4.0mils) |
Minimum measurable hole size |
899um (35mils) |