3D automatic X-ray inspection system for PoP(Package on Package), having the latest semiconductor layering technology. From
loading to judgement of NG / Good & sorting out of PoP products would be made automatically. And the results would be saved into
basic data based to help SPC. It has the fastest inspection speed of 2.5 sec/FOV.
General Product Features | |
---|---|
X-ray Tube | 130㎸ / 200㎂ |
Min Resolution | 6 ~ 15㎛ |
Detector | 12 inch FPXD |
Chip Size | Max 22 x 22mm, Min 8 x 6mm |
검사 항목 | Non-wet, Open, Short, Big / Small ball |
Dimension | 3,080(W) x 1,730(D) x 1,920(H)mm / 4,800kg |
X-Ray Image