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Elec-Beam Machinery
X-eye 6200
작성자 관리자
날짜 2023-07-24 14:58:29
Automatically In-Line inspect Solder Joint defects of PCBA, and other defects on Hidden Components. Able to judge Good / NG fast with
inspection speed of 0.5 sec/FOV and the program can set ROIs conveniently. Performing X-ray inspection in various production sites,
integrated with other manufacturing equipment.
- High speed 2D In-Line Inspection System (0.5 sec/FOV)
- Various defect inspection - BGA, Chip, QFN, QFP, etc.
- WAXI : Wire Automatic X-ray Inspection detection of
wire defects possible (Shorts, Sweep, Missing, etc.)
| General Product Features | |
|---|---|
| X-ray Tube | 160㎸ / 500㎂ (Option 130㎸ / 300㎂) |
| Min Resolution | 0.8 ~ 15㎛ |
| Table Size | Max 330 x 250mm, Min 50 x 50mm |
| Detector | 5 inch FPXD |
| 검사 대상 | GA, Chip, QFN, QFP, Wire Bonding |
| 검사 항목 | BGA : Short, Bridging, Void Chip : Manhattan, Miss align, Short Wire Bonding : Sweep, Broken, Double Bonding, Missing |
| Dimension | 1,460(W) x 1,640(D) x 1,780(H)mm / 2,500kg |
X-ray Image
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