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Elec-Beam Machinery

X-eye 6300

작성자 관리자 날짜 2023-07-24 15:28:45

Automatically inspects the defects of product in customer’s line with high-speed 3D CT. Able to inspect every defect of Double-sided 
PCBA & BGA mounted component precisely by solving overlapped X-ray image issue. Inspection speed of 4 sec/FOV from loading to 
automatic Good / NG judgement.

  • High speed 3D In-Line Inspection System (~4 sec/FOV)
  • Best Solution for Both-sides layered PCB
  • Various defects detectable - BGA, Chip component and etc.
General Product Features
X-ray Tube 160㎸ / 500㎂
Min Resolution 0.8 ~ 15㎛
Table Size Max 330 x 250mm, Min 50 x 50mm
Detector 12 inch FPXD
Component Types BGA, Chip, QFN, Connector, PoP, Though Hole
Defect Item Short, Bridging, Open, De-wet, Void, etc.
Dimension 1,360(W) x 1,880(D) x 1,700(H)mm / 4,200kg

X-ray Image

 
 
 

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