Elec-Beam Machinery

Nano-focus Tube of 200 nano resolution is installed which is specialized for Semiconductor Packaging, Wafer Level Packaging(WLP) 
requiring detection of Sub-micron defect. Able to trace and inspect defected area precisely by precise movement of axis with Antivibration
table. Tomography is available if 3D CT module is added and Wafer Bump Automatic Inspection is available from loadeing 
to inspection with wafer handler systems.

• Non-destructive analysis system for Wafer Level Packaging 
• High resolution image with Dual Type CTs
• TSV, Micro Bump, Patterm

X-ray Image