It plays a role in supplementing the difficulty of horizontal polishing due to the one-sided wear phenomenon by the difference in the configured material of the molding sample product or the one-sided wear phenomenon caused by the operator's skill during the microsection operation.
The scale located at the top is a scale for adjust the grinding work thickness, and the sample is fixed to the holder and mounted on the base to adjust the reference point. Then, the target grinding and polishing thickness is set by adjusting the upper scale, and the corresponding work is performed.
The ultra-hard ceramic ring on the floor prevents excessive grinding work (wearing).